Two-Phase Jet Impingement Liquid Cooling: PUE < 1.05 and scalable to 10 kW+ TDP Capacity
Our Technology
SemiValley has developed a patented two-phase jet-impingement liquid cooling cold plate, originally prototyped under the U.S. DOE's ARPA-E COOLERCHIPS program. Our technology sprays a dielectric coolant or water directly onto chip surfaces, where it boils on contact to absorb heat via latent heat transfer — delivering over 16× the thermal performance of conventional single-phase solutions.
Estimated Savings
By reducing infrastructure overhead from PUE 1.5 (air cooling) to PUE 1.03, SemiValley will cut non-IT power by ~70%, translating to ~$1.5B/year in electricity savings at typical U.S. data-center energy prices.
Assumes 3 GW IT load, continuous operation, ~$0.12/kWh electricity cost.
What Makes Us Different
Most competitors offer either jet impingement or two-phase boiling — not both. SemiValley combines both in a single cold plate, capturing impingement's high heat-transfer coefficient and boiling's latent heat capacity.
Performance Comparison
| Metric | Air Cooling | Single-Phase | SemiValley |
|---|---|---|---|
| PUE | 1.3 – 1.6+ | 1.10 – 1.30 | 1.02–1.05 |
| Cooling Overhead | 30 – 50% | 10 – 30% | 2 – 5% |
| TDP Capacity | ~0.5 kW | ~2 kW | Scalable to 10 kW+ |
| Water Usage | High | Moderate | Low |
| OpEx Savings | Baseline | ~15 – 20% | > 35 – 42% |
Sources: Uptime Institute; IDTechEx; ARPA-E; SemiValley internal lab data.
Development Roadmap
Prototype Performance
Testing prototypes on latest AI chips to demonstrate extreme thermal performance at single-chip level.
Reliable Manufacturing
Integration into the cooling system and validation test on a single chip/server.
Scalable Cluster Testing
Datacenter rack-level testing.
The Team
Our team brings together experts with deep expertise in thermal sciences, semiconductor technologies, and strategic investment.
