By the Numbers
Performance That Speaks for Itself
< 1.05
PUE
vs. 1.3–1.6+ for air cooling
16×
Thermal Performance
vs. conventional single-phase
~$1.5B
Annual Savings
for a 3 GW datacenter
10 kW+
TDP Capacity
scalable per chip
Our Technology
What Makes Us Different
Patented cold plate developed under the U.S. DOE's ARPA-E COOLERCHIPS program — combining jet impingement and two-phase boiling for unmatched thermal density.
1
Two-Phase Jet Impingement
Combines jet impingement's high heat-transfer coefficient with boiling's latent heat capacity in a single cold plate.
2
Stable Operation
Jet momentum with phase-separation layer eliminates dry-out failure and flow instability at high dissipation power.
3
Low Power Consumption
1/10th the pumping power of conventional liquid cooling, reducing infrastructure cost and environmental footprint.
Research & Program Affiliations
